CDP1824D
vs
CDP1824EX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
INTERSIL CORP
Package Description
DIP-18
PLASTIC, DIP-18
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
320 ns
320 ns
JESD-30 Code
R-CDIP-T18
R-PDIP-T18
JESD-609 Code
e0
e0
Memory Density
256 bit
256 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
32 words
32 words
Number of Words Code
32
32
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32X8
32X8
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.00001 A
0.00001 A
Standby Voltage-Min
2.5 V
2.5 V
Supply Current-Max
0.016 mA
0.016 mA
Supply Voltage-Max (Vsup)
10.5 V
10.5 V
Supply Voltage-Min (Vsup)
4 V
4 V
Supply Voltage-Nom (Vsup)
10 V
10 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Part Package Code
DIP
Pin Count
18
Compare CDP1824D with alternatives
Compare CDP1824EX with alternatives