CDCU877ARHA vs IDTCSPU877ABVG feature comparison

CDCU877ARHA Texas Instruments

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IDTCSPU877ABVG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN BGA
Package Description HVQCCN, LCC40,.24SQ,20 TFBGA, BGA52,6X10,25
Pin Count 40 52
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 877 877
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code S-PQCC-N40 R-PBGA-B52
JESD-609 Code e4 e1
Length 6 mm 7 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A 0.009 A
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 40 52
Number of True Outputs 10 10
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TFBGA
Package Equivalence Code LCC40,.24SQ,20 BGA52,6X10,25
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.035 ns 0.04 ns
Seated Height-Max 1 mm 1.05 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish NICKEL PALLADIUM GOLD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form NO LEAD BALL
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD BOTTOM
Width 6 mm 4.5 mm
fmax-Min 340 MHz 340 MHz
Base Number Matches 5 2
Pbfree Code Yes
Rohs Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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