IDTCSPU877ABVG
vs
CDCU877AGQLT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA52,6X10,25
BGA-52
Pin Count
52
52
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
877
877
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-PBGA-B52
R-PBGA-B52
JESD-609 Code
e1
e0
Length
7 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.009 A
0.009 A
Moisture Sensitivity Level
3
2
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
52
Number of True Outputs
10
10
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Equivalence Code
BGA52,6X10,25
BGA52,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.035 ns
Seated Height-Max
1.05 mm
1 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
4.5 mm
4.5 mm
fmax-Min
340 MHz
340 MHz
Base Number Matches
1
1
Technology
CMOS
Compare IDTCSPU877ABVG with alternatives
Compare CDCU877AGQLT with alternatives