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CD54HCT259F/3A vs 74HCT259PW,118 feature comparison

CD54HCT259F/3A Intersil Corporation

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74HCT259PW,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Reach Compliance Code unknown compliant
Additional Feature 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH
Family HCT HCT
JESD-30 Code R-CDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Logic IC Type D LATCH D LATCH
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 57 ns 57 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type LOW LEVEL LOW LEVEL
Base Number Matches 2 1
Part Package Code TSSOP
Pin Count 16
Manufacturer Package Code SOT403-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Length 5 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.00002 A
Moisture Sensitivity Level 1
Package Code TSSOP
Package Equivalence Code TSSOP16,.25
Packing Method TR
Prop. Delay@Nom-Sup 59 ns
Seated Height-Max 1.1 mm
Terminal Pitch 0.65 mm
Width 4.4 mm
Logic » FF/Latches
Logic » FF/Latches

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