CD4543BF
vs
MC14543BCPD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
HERMETIC SEALED, CERAMIC, DIP-16
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
kg CO2e/kg
12.04
Average Weight (mg)
1187.4
CO2e (mg)
14296.296
Category CO2 Kg
12.6
12.04
Compliance Temperature Grade
Military: -55C to +125C
Candidate List Date
2019-01-15
SVHC Over MCV
7439-92-1
EFUP
50
Family
4000/14000/40000
Input Conditioning
LATCHED
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Logic IC Type
SEVEN SEGMENT DECODER/DRIVER
Number of Functions
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
CONFIGURABLE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
1200 ns
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
6
3
Display Mode
SEGMENT
JESD-609 Code
e0
Number of Backplanes
0-BP
Number of Segments
7
Package Equivalence Code
DIP16,.3
Power Supplies
5/15 V
Terminal Finish
Tin/Lead (Sn/Pb)
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