CD4078BFMSR
vs
HEF4078BDF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
NXP SEMICONDUCTORS
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
RADIATION HARDENED
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR/NOR GATE
NOR GATE
Max Frequency@Nom-Sup
3000000 Hz
Max I(ol)
0.00035999999999999997 A
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
405 ns
Propagation Delay (tpd)
405 ns
160 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Screening Level
38535V;38534K;883S
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
14
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare CD4078BFMSR with alternatives
Compare HEF4078BDF with alternatives