CD4050UBDT vs M38510/05554BEX feature comparison

CD4050UBDT Texas Instruments

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M38510/05554BEX Rochester Electronics LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC ROCHESTER ELECTRONICS LLC
Part Package Code SOIC DIP
Package Description SOP, SOP16,.25 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-GDIP-T16
Length 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Prop. Delay@Nom-Sup 140 ns
Propagation Delay (tpd) 140 ns 345 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 5 V 4.5 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 1 1
Screening Level MIL-PRF-38535 Class B

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