CD4050BMJ/883 vs CD4050BD3 feature comparison

CD4050BMJ/883 Texas Instruments

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CD4050BD3 Harris Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP HARRIS SEMICONDUCTOR
Package Description DIP, DIP16,.3 DIP-16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-CDIP-T16
JESD-609 Code e0 e0
Length 19.43 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 170 ns 140 ns
Propagation Delay (tpd) 155 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 1
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Load Capacitance (CL) 50 pF
Max I(ol) 0.0018 A
Supply Voltage-Nom (Vsup) 5 V

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