CD4041AD3
vs
HEF4041BPN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
PACKAGE-14
DIP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Logic IC Type
INVERTER/BUFFER
INVERTER/BUFFER
Number of Functions
4
4
Number of Inputs
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
120 ns
75 ns
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
kg CO2e/kg
12.4
Average Weight (mg)
1630.6
CO2e (mg)
20219.441
Category CO2 Kg
12.4
Compliance Temperature Grade
Industrial: -40C to +85C
Length
19.025 mm
Load Capacitance (CL)
50 pF
Qualification Status
Not Qualified
Seated Height-Max
4.2 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare CD4041AD3 with alternatives
Compare HEF4041BPN with alternatives