HEF4041BPN vs 5962R9663202VCC feature comparison

HEF4041BPN Philips Semiconductors

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5962R9663202VCC Intersil Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS INTERSIL CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-CDIP-T14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER/BUFFER INVERTER/BUFFER
Max I(ol) 0.00035999999999999997 A 0.0021000000000000003 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 75 ns 162 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code DIP
Pin Count 14
Family 4000/14000/40000
Number of Functions 4
Number of Inputs 1
Propagation Delay (tpd) 162 ns
Screening Level MIL-PRF-38535 Class V
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Total Dose 100k Rad(Si) V

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