BZV55C4V7 vs BZV55C4V7TRL feature comparison

BZV55C4V7 SPC Multicomp

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BZV55C4V7TRL YAGEO Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MULTICOMP PRO PHILIPS COMPONENTS
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-LELF-R2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Reference Voltage-Nom 4.7 V 4.7 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5% 5%
Working Test Current 2 mA 5 mA
Base Number Matches 1 2
Qualification Status Not Qualified
Reverse Current-Max 3 µA
Voltage Temp Coeff-Max

Compare BZV55C4V7 with alternatives

Compare BZV55C4V7TRL with alternatives