BUZ323 vs IRFP341 feature comparison

BUZ323 Siemens

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IRFP341 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SIEMENS A G SAMSUNG SEMICONDUCTOR INC
Package Description FLANGE MOUNT, R-PSFM-T3 TO-3P, 3 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.95
Category CO2 Kg 8.8
Avalanche Energy Rating (Eas) 790 mJ 520 mJ
Configuration SINGLE SINGLE
DS Breakdown Voltage-Min 400 V 350 V
Drain Current-Max (ID) 15 A 10 A
Drain-source On Resistance-Max 0.3 Ω 0.55 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 180 pF
JEDEC-95 Code TO-218
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation Ambient-Max 170 W 125 W
Power Dissipation-Max (Abs) 170 W 150 W
Pulsed Drain Current-Max (IDM) 60 A 40 A
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 520 ns 111 ns
Turn-on Time-Max (ton) 180 ns 62 ns
Base Number Matches 1 1
Part Package Code TO-3P
Pin Count 3

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