BUX53SMD
vs
BUX53SMD-JQR
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TT ELECTRONICS PLC
TT ELECTRONICS PLC
Package Description
HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
3 A
3 A
Collector-Emitter Voltage-Max
325 V
325 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
20
20
JEDEC-95 Code
TO-276AB
TO-276AB
JESD-30 Code
R-CBCC-N3
R-CBCC-N3
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
NO LEAD
NO LEAD
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
8 MHz
8 MHz
Base Number Matches
20
6
Compare BUX53SMD with alternatives
Compare BUX53SMD-JQR with alternatives