BUX53SMD
vs
BUX53SMD-JQRR4
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SEMELAB LTD
|
TT ELECTRONICS PLC
|
| Part Package Code |
TO-276AB
|
|
| Package Description |
CHIP CARRIER, R-CBCC-N3
|
HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
COLLECTOR
|
COLLECTOR
|
| Collector Current-Max (IC) |
3 A
|
3 A
|
| Collector-Emitter Voltage-Max |
325 V
|
325 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
20
|
20
|
| JEDEC-95 Code |
TO-276AB
|
TO-276AB
|
| JESD-30 Code |
R-CBCC-N3
|
R-CBCC-N3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
8 MHz
|
8 MHz
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare BUX53SMD with alternatives
Compare BUX53SMD-JQRR4 with alternatives