BUX53SMD
vs
BUX53SMD-QR-B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TT ELECTRONICS PLC
TT ELECTRONICS PLC
Package Description
HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
HERMETICALLY SEALED, CERAMIC, SMD1, 3 PIN
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Case Connection
COLLECTOR
COLLECTOR
Collector Current-Max (IC)
3 A
3 A
Collector-Emitter Voltage-Max
325 V
325 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
20
20
JEDEC-95 Code
TO-276AB
TO-276AB
JESD-30 Code
R-CBCC-N3
R-CBCC-N3
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
NO LEAD
NO LEAD
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
8 MHz
8 MHz
Base Number Matches
2
2
Compare BUX53SMD with alternatives
Compare BUX53SMD-QR-B with alternatives