BUK118-50DL,127
vs
STA508A
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Part Package Code |
TO-220AB
|
SOIC
|
| Package Description |
TO-220, SIP3,.1TB
|
HSSOP,
|
| Pin Count |
3
|
36
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
OVER CURRENT; OVER VOLTAGE; THERMAL
|
OVER CURRENT; THERMAL; UNDER VOLTAGE
|
| Driver Number of Bits |
1
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
HALF BRIDGE BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PSFM-T3
|
R-PDSO-G36
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
3
|
36
|
| Operating Temperature-Max |
150 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current Flow Direction |
SINK
|
SOURCE AND SINK
|
| Output Current-Max |
16 A
|
|
| Output Peak Current Limit-Nom |
24 A
|
6 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TO-220
|
HSSOP
|
| Package Equivalence Code |
SIP3,.1TB
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
MOS
|
BCD
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
SINGLE
|
DUAL
|
| Turn-off Time |
140 µs
|
0.1 µs
|
| Turn-on Time |
30 µs
|
0.1 µs
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Length |
|
15.7 mm
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Seated Height-Max |
|
3.43 mm
|
| Supply Voltage-Max |
|
36 V
|
| Supply Voltage-Min |
|
9 V
|
| Supply Voltage-Nom |
|
30 V
|
| Width |
|
11 mm
|
|
|
|
Compare BUK118-50DL,127 with alternatives
Compare STA508A with alternatives