BUK118-50DL,127 vs BUK118-50DL feature comparison

BUK118-50DL,127 NXP Semiconductors

Buy Now Datasheet

BUK118-50DL Philips Semiconductors

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code TO-220AB
Package Description TO-220, SIP3,.1TB , SIP3,.1TB
Pin Count 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections OVER CURRENT; OVER VOLTAGE; THERMAL
Driver Number of Bits 1 1
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PSFM-T3
JESD-609 Code e3 e0
Number of Functions 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -40 °C -40 °C
Output Current Flow Direction SINK
Output Current-Max 16 A 16 A
Output Peak Current Limit-Nom 24 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TO-220 SIP
Package Equivalence Code SIP3,.1TB SIP3,.1TB
Package Shape RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology MOS MOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position SINGLE SINGLE
Turn-off Time 140 µs
Turn-on Time 30 µs
Base Number Matches 1 2
Supply Voltage-Nom 13 V

Compare BUK118-50DL,127 with alternatives