BUK118-50DL,127
vs
BUK118-50DL
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
TO-220AB
TO-220AB
Package Description
TO-220, SIP3,.1TB
TO-220, SIP3,.1TB
Pin Count
3
3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Built-in Protections
OVER CURRENT; OVER VOLTAGE; THERMAL
OVER CURRENT; OVER VOLTAGE; THERMAL
Driver Number of Bits
1
1
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code
R-PSFM-T3
R-PSFM-T3
JESD-609 Code
e3
e3
Number of Functions
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current Flow Direction
SINK
SOURCE
Output Current-Max
16 A
16 A
Output Peak Current Limit-Nom
24 A
24 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TO-220
TO-220
Package Equivalence Code
SIP3,.1TB
SIP3,.1TB
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
MOS
MOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
SINGLE
SINGLE
Turn-off Time
140 µs
140 µs
Turn-on Time
30 µs
30 µs
Base Number Matches
1
2
Compare BUK118-50DL,127 with alternatives
Compare BUK118-50DL with alternatives