BU8242F-E2
vs
UAA2077AM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ROHM CO LTD
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOP,
LSSOP, SSOP20,.25
Pin Count
20
20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e3/e2
Length
12.5 mm
6.5 mm
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-25 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
LSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
1.5 mm
Supply Current-Max
8 mA
33.5 mA
Supply Voltage-Nom
5 V
4 V
Surface Mount
YES
YES
Telecom IC Type
CORDLESS TELEPHONE SUPPORT CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
TIN/TIN COPPER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
10
Width
5.4 mm
4.4 mm
Base Number Matches
1
2
Package Equivalence Code
SSOP20,.25
Technology
BICMOS
Compare BU8242F-E2 with alternatives
Compare UAA2077AM with alternatives