BU4030BF-E2
vs
HEF4030BP,652
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROHM CO LTD
NXP SEMICONDUCTORS
Part Package Code
SOIC
DIP
Package Description
ROHS COMPLIANT, SOP-14
PLASTIC, DIP-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
ROHM Semiconductor
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
JESD-609 Code
e2
e4
Length
8.7 mm
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
XOR GATE
XOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSOP
DIP
Package Equivalence Code
SOP14,.25
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
90 ns
175 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.6 mm
4.2 mm
Supply Voltage-Max (Vsup)
16 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Copper (Sn/Cu)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
7.62 mm
Base Number Matches
1
1
Manufacturer Package Code
SOT27-1
Factory Lead Time
4 Weeks
Max I(ol)
0.00035999999999999997 A
Prop. Delay@Nom-Sup
175 ns
Compare BU4030BF-E2 with alternatives
Compare HEF4030BP,652 with alternatives