HEF4030BP,652
vs
M38510/05303BCA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-14
DIP,
Pin Count
14
14
Manufacturer Package Code
SOT27-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e4
Length
19.025 mm
Load Capacitance (CL)
50 pF
Logic IC Type
XOR GATE
XOR GATE
Max I(ol)
0.00035999999999999997 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
175 ns
Propagation Delay (tpd)
175 ns
270 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
15 V
12.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
4
Screening Level
MIL-PRF-38535 Class B
Compare HEF4030BP,652 with alternatives
Compare M38510/05303BCA with alternatives