HEF4030BP,652
vs
CD4070BFSR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTERSIL CORP
Part Package Code
DIP
Package Description
PLASTIC, DIP-14
DIP, DIP14,.3
Pin Count
14
Manufacturer Package Code
SOT27-1
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Family
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
JESD-609 Code
e4
e0
Length
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
XOR GATE
XOR GATE
Max I(ol)
0.00035999999999999997 A
0.00035999999999999997 A
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
175 ns
378 ns
Propagation Delay (tpd)
175 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Screening Level
38535V;38534K;883S
Total Dose
100k Rad(Si) V
Compare HEF4030BP,652 with alternatives
Compare CD4070BFSR with alternatives