BF822T/R vs BF822,215 feature comparison

BF822T/R NXP Semiconductors

Buy Now Datasheet

BF822,215 Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SOT-23 TO-236
Package Description PLASTIC PACKAGE-3 PLASTIC, SST3, SMD, 3 PIN
Pin Count 3 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 0.05 A 0.05 A
Collector-Base Capacitance-Max 1.6 pF 1.6 pF
Collector-Emitter Voltage-Max 250 V 250 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 50 50
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 0.31 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish MATTE TIN TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 60 MHz 60 MHz
VCEsat-Max 0.6 V 0.6 V
Base Number Matches 3 1
Manufacturer Package Code SOT23
Date Of Intro 1997-09-01
Samacsys Manufacturer Nexperia
Moisture Sensitivity Level 1
Time@Peak Reflow Temperature-Max (s) 30

Compare BF822T/R with alternatives

Compare BF822,215 with alternatives