BDW23 vs 2N5875 feature comparison

BDW23 Bourns Inc

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2N5875 Microchip Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer BOURNS INC MICROCHIP TECHNOLOGY INC
Part Package Code TO-220AB
Package Description PLASTIC, TO-220, FM-3
Pin Count 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Case Connection COLLECTOR
Collector Current-Max (IC) 6 A 10 A
Collector-Emitter Voltage-Max 45 V 60 V
Configuration DARLINGTON
DC Current Gain-Min (hFE) 100 20
JEDEC-95 Code TO-220AB TO-3
JESD-30 Code R-PSFM-T3 O-MBFM-P2
Number of Elements 1
Number of Terminals 3 2
Package Body Material PLASTIC/EPOXY METAL
Package Shape RECTANGULAR ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type NPN PNP
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Position SINGLE BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 8 1
Factory Lead Time 36 Weeks
JESD-609 Code e0
Terminal Finish TIN LEAD

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