BCW30 vs BCW30 feature comparison

BCW30 NXP Semiconductors

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BCW30 ROHM Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ROHM CO LTD
Part Package Code SOT-23
Package Description PLASTIC PACKAGE-3
Pin Count 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Samacsys Manufacturer NXP
Collector Current-Max (IC) 0.1 A 0.1 A
Collector-Emitter Voltage-Max 32 V 32 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 215 210
JEDEC-95 Code TO-236AB
JESD-30 Code R-PDSO-G3 R-PDSO-G3
JESD-609 Code e3 e1
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type PNP PNP
Power Dissipation-Max (Abs) 0.25 W 0.3 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Finish Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 10
Transistor Application SWITCHING AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 100 MHz 250 MHz
VCEsat-Max 0.3 V 0.3 V
Base Number Matches 16 4
Collector-Base Capacitance-Max 7 pF

Compare BCW30 with alternatives

Compare BCW30 with alternatives