BCN218SBI103J13
vs
CND2A10YLTE103J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
BI TECHNOLOGIES CORP
KOA SPEER ELECTRONICS INC
Package Description
SMT, 0816
CHIP
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
10000 Ω
10000 Ω
JESD-609 Code
e3
e0
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
155 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.6 mm
Package Length
4 mm
4 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.1 mm
2.1 mm
Packing Method
TR, PLASTIC, 13 INCH
TR, EMBOSSED PLASTIC, 7 INCH
Rated Power Dissipation (P)
0.063 W
0.063 W
Rated Temperature
70 °C
70 °C
Resistance
10000 Ω
10000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
10000 Ω
Size Code
1608
0816
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb)
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
2
1
Compare BCN218SBI103J13 with alternatives
Compare CND2A10YLTE103J with alternatives