CND2A10YLTE103J
vs
CND2A10YLBK103J
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
KOA CORP
Package Description
CHIP
SMT, 1608
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
Element Power Dissipation
0.063 W
First Element Resistance
10000 Ω
JESD-609 Code
e0
e0
Mounting Feature
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
Number of Functions
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
4 mm
4 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.1 mm
2.1 mm
Packing Method
TR, EMBOSSED PLASTIC, 7 INCH
Bulk
Rated Power Dissipation (P)
0.063 W
0.063 W
Rated Temperature
70 °C
Resistance
10000 Ω
10000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Size Code
0816
1608
Surface Mount
YES
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Technology
METAL GLAZE/THICK FILM
Compare CND2A10YLTE103J with alternatives
Compare CND2A10YLBK103J with alternatives