BCN218SBI103J13
vs
BCN218SBI103J7
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TT ELECTRONICS PLC
TT ELECTRONICS PLC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
Construction
Rectangular
Rectangular
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
10000 Ω
10000 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
4 mm
4 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.1 mm
2.1 mm
Packing Method
TR, PLASTIC, 13 INCH
TR, Plastic, 7 Inch
Rated Power Dissipation (P)
0.063 W
0.063 W
Rated Temperature
70 °C
70 °C
Resistance
10000 Ω
10000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
10000 Ω
10000 Ω
Size Code
1608
1608
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
2
2
Compare BCN218SBI103J13 with alternatives
Compare BCN218SBI103J7 with alternatives