BAS28-TP-HF
vs
BAS28
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Samacsys Manufacturer |
MCC
|
NXP
|
| Application |
GENERAL PURPOSE
|
|
| Configuration |
SEPARATE, 2 ELEMENTS
|
SEPARATE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Non-rep Pk Forward Current-Max |
4 A
|
4 A
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
|
| Output Current-Max |
0.215 A
|
0.215 A
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Rep Pk Reverse Voltage-Max |
85 V
|
85 V
|
| Surface Mount |
YES
|
YES
|
| Base Number Matches |
1
|
9
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
PLASTIC PACKAGE-4
|
| Pin Count |
|
4
|
| Case Connection |
|
CATHODE
|
| Forward Voltage-Max (VF) |
|
1.25 V
|
| JESD-30 Code |
|
R-PDSO-G4
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
4
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max |
|
0.25 W
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
CECC50001-074
|
| Reverse Current-Max |
|
1 µA
|
| Reverse Recovery Time-Max |
|
0.004 µs
|
| Reverse Test Voltage |
|
75 V
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BAS28-TP-HF with alternatives
Compare BAS28 with alternatives