BAS28-TP-HF vs BAS28,235 feature comparison

BAS28-TP-HF Micro Commercial Components

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BAS28,235 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS NXP SEMICONDUCTORS
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Samacsys Manufacturer MCC
Application GENERAL PURPOSE
Configuration SEPARATE, 2 ELEMENTS SEPARATE, 2 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code R-PDSO-G4 R-PDSO-G4
Non-rep Pk Forward Current-Max 4 A 4 A
Number of Elements 2 2
Number of Phases 1
Number of Terminals 4 4
Output Current-Max 0.215 A 0.215 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Rep Pk Reverse Voltage-Max 85 V 85 V
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 2
Part Package Code SOT-143
Package Description PLASTIC PACKAGE-4
Pin Count 4
Manufacturer Package Code SOT143B
Factory Lead Time 4 Weeks
Case Connection CATHODE
Forward Voltage-Max (VF) 1.25 V
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.25 W
Qualification Status Not Qualified
Reference Standard CECC50001-074
Reverse Current-Max 1 µA
Reverse Recovery Time-Max 0.004 µs
Reverse Test Voltage 75 V
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare BAS28-TP-HF with alternatives

Compare BAS28,235 with alternatives