B57238-S250-M
vs
B57660G0493H000
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SIEMENS A G
|
TDK CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.40.80.70
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Number of Terminals |
2
|
2
|
| Package Shape |
DISK PACKAGE
|
DISK PACKAGE
|
| Rated Power Dissipation (P) |
3.9 W
|
|
| Resistance |
25 Ω
|
49100 Ω
|
| Resistor Type |
NTC THERMISTOR
|
NTC THERMISTOR
|
| Surface Mount |
NO
|
NO
|
| Terminal Shape |
WIRE
|
WIRE
|
| Thermal Sensitivity Index |
3265 K
|
3992 K
|
| Thermistor Application |
SOFT START
|
TEMPERATURE SENSING
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Package Description |
|
RADIAL LEADED
|
| Additional Feature |
|
GLASS ENCAPSULATED
|
| JESD-609 Code |
|
e3
|
| Manufacturer Series |
|
B57660
|
| Operating Temperature-Max |
|
300 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Packing Method |
|
BULK
|
| Terminal Finish |
|
TIN/COPPER
|
| Terminal Placement |
|
RADIAL
|
| Tolerance |
|
3%
|
|
|
|
Compare B57238-S250-M with alternatives
Compare B57660G0493H000 with alternatives