ATL431LIBQDQNR
vs
TL431AFDT
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Package Description |
HVSON,
|
PLASTIC, TO-236AB, SOT-23, 3 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2019-11-17
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
THREE TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
S-PDSO-N4
|
R-PDSO-G3
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
4
|
3
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
2.512 V
|
2.55 V
|
| Output Voltage-Min |
2.487 V
|
2.47 V
|
| Output Voltage-Nom |
2.5 V
|
2.495 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.4 mm
|
1.1 mm
|
| Surface Mount |
YES
|
YES
|
| Temp Coef of Voltage-Max |
66 ppm/°C
|
888 ppm/°C
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Trim/Adjustable Output |
YES
|
YES
|
| Width |
1 mm
|
1.3 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
SOT-23
|
| Pin Count |
|
3
|
| Supply Voltage-Max (Vsup) |
|
36 V
|
| Supply Voltage-Min (Vsup) |
|
2.495 V
|
|
|
|
Compare ATL431LIBQDQNR with alternatives