AT91SAM9261SB-CU vs P80C31SBPN,112 feature comparison

AT91SAM9261SB-CU Atmel Corporation

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P80C31SBPN,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL CORP NXP SEMICONDUCTORS
Part Package Code BGA DIP
Package Description ROHS COMPLIANT, MO-205, LFBGA-217 DIP, DIP40,.6
Pin Count 217 40
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Microchip NXP
Has ADC YES NO
Address Bus Width 26 16
Bit Size 32 8
CPU Family ARM9 8051
Clock Frequency-Max 50 MHz 16 MHz
DAC Channels YES NO
DMA Channels YES NO
External Data Bus Width 32 8
JESD-30 Code S-PBGA-B217 R-PDIP-T40
JESD-609 Code e1 e3
Length 15 mm 52 mm
Number of I/O Lines 93 32
Number of Terminals 217 40
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
PWM Channels YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA DIP
Package Equivalence Code BGA217,17X17,32 DIP40,.6
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 16384 128
ROM (words) 32768
ROM Programmability FLASH
Seated Height-Max 1.4 mm 4.7 mm
Speed 66 MHz 16 MHz
Supply Voltage-Max 1.32 V 5.5 V
Supply Voltage-Min 1.2 V 2.7 V
Supply Voltage-Nom 1.2 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN
Terminal Form BALL THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position BOTTOM DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 15 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER
Base Number Matches 1 1
Manufacturer Package Code SOT129-1
Supply Current-Max 50 mA

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