AT91SAM9261SB-CU vs AT91SAM9261S-CJ feature comparison

AT91SAM9261SB-CU Atmel Corporation

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AT91SAM9261S-CJ Atmel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code BGA BGA
Package Description ROHS COMPLIANT, MO-205, LFBGA-217 LFBGA, BGA217,17X17,32
Pin Count 217 217
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Microchip
Has ADC YES YES
Address Bus Width 26 26
Bit Size 32 32
CPU Family ARM9 ARM9
Clock Frequency-Max 50 MHz 50 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B217 S-PBGA-B217
JESD-609 Code e1 e1
Length 15 mm 15 mm
Number of I/O Lines 93 93
Number of Terminals 217 217
On Chip Program ROM Width 8 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA217,17X17,32 BGA217,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 16384 16384
ROM (words) 32768 8192
ROM Programmability FLASH FASTROM
Seated Height-Max 1.4 mm 1.4 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.2 V 1.08 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 15 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 2

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