AT91SAM9261S-CU
vs
SC87C51AGF40
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
LFBGA,
WDIP,
Pin Count
217
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
26
16
Bit Size
32
8
Clock Frequency-Max
50 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
YES
NO
External Data Bus Width
32
8
JESD-30 Code
S-PBGA-B217
R-GDIP-T40
Length
15 mm
52.39 mm
Number of I/O Lines
96
32
Number of Terminals
217
40
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
LFBGA
WDIP
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
IN-LINE, WINDOW
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
MROM
UVPROM
Seated Height-Max
1.4 mm
5.72 mm
Speed
240 MHz
16 MHz
Supply Voltage-Max
1.32 V
5.5 V
Supply Voltage-Min
1.08 V
5 V
Supply Voltage-Nom
1.2 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
THROUGH-HOLE
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
BOTTOM
DUAL
Width
15 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER
Base Number Matches
1
1
Boundary Scan
NO
Format
FIXED POINT
Integrated Cache
NO
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of Serial I/Os
1
Number of Timers
2
On Chip Data RAM Width
8
On Chip Program ROM Width
8
RAM (words)
128
ROM (words)
4096
Supply Current-Max
25 mA
Compare AT91SAM9261S-CU with alternatives
Compare SC87C51AGF40 with alternatives