AT91SAM9261S-CU
vs
P80C52UBPN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
NXP SEMICONDUCTORS
Part Package Code
BGA
DIP
Package Description
LFBGA,
DIP, DIP40,.6
Pin Count
217
40
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
26
16
Bit Size
32
8
Clock Frequency-Max
50 MHz
33 MHz
DAC Channels
NO
NO
DMA Channels
YES
NO
External Data Bus Width
32
8
JESD-30 Code
S-PBGA-B217
R-PDIP-T40
Length
15 mm
52 mm
Number of I/O Lines
96
32
Number of Terminals
217
40
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
IN-LINE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
MROM
MROM
Seated Height-Max
1.4 mm
4.7 mm
Speed
240 MHz
33 MHz
Supply Voltage-Max
1.32 V
5.5 V
Supply Voltage-Min
1.08 V
5 V
Supply Voltage-Nom
1.2 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
THROUGH-HOLE
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
BOTTOM
DUAL
Width
15 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER
Base Number Matches
1
2
Rohs Code
CPU Family
8051
On Chip Program ROM Width
8
Package Equivalence Code
DIP40,.6
RAM (bytes)
256
ROM (words)
8192
Supply Current-Max
30.8 mA
Compare AT91SAM9261S-CU with alternatives
Compare P80C52UBPN with alternatives