AS6C62256A-70SIN vs K6X0808C1D-BF70T feature comparison

AS6C62256A-70SIN Alliance Memory Inc

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K6X0808C1D-BF70T Samsung Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ALLIANCE MEMORY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC
Package Description 0.330 INCH, ROHS COMPLIANT, SOP-28
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Samacsys Manufacturer Alliance Memory
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 1
Number of Functions 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.45 SOP28,.45
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Reverse Pinout YES
Seated Height-Max 3.048 mm
Standby Current-Max 0.000006 A 0.00001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.07 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare AS6C62256A-70SIN with alternatives

Compare K6X0808C1D-BF70T with alternatives