AS6C1008-55BIN
vs
IS65WV1288BLL-55HLA3
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ALLIANCE MEMORY INC
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
BGA
|
TSOP1
|
| Pin Count |
36
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
16 Weeks
|
|
| Samacsys Manufacturer |
Alliance Memory
|
|
| Access Time-Max |
55 ns
|
55 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B36
|
R-PDSO-G32
|
| Length |
8 mm
|
18.4 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TSOP1
|
| Package Equivalence Code |
BGA36,6X8,30
|
TSSOP32,.56,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Standby Current-Max |
0.000003 A
|
0.000075 A
|
| Standby Voltage-Min |
1.5 V
|
1.2 V
|
| Supply Current-Max |
0.06 mA
|
0.035 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.75 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
6 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
TSOP1, TSSOP32,.56,20
|
| JESD-609 Code |
|
e3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare AS6C1008-55BIN with alternatives
Compare IS65WV1288BLL-55HLA3 with alternatives