AS4684NBG8
vs
NLAS4684MNR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ONSEMI
Part Package Code
DFN
DFN10, 3x3, 0.5P
Package Description
3 X 3 MM, ROHS COMPLIANT, DFN-10
QFN-10
Pin Count
10
10
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
S-XDSO-N10
S-XDSO-N10
JESD-609 Code
e3
e0
Length
3 mm
3 mm
Moisture Sensitivity Level
1
Number of Channels
1
1
Number of Functions
2
2
Number of Terminals
10
10
Off-state Isolation-Nom
64 dB
65 dB
On-state Resistance Match-Nom
0.6 Ω
0.06 Ω
On-state Resistance-Max (Ron)
0.8 Ω
1 Ω
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVSON
HVSON
Package Equivalence Code
SOLCC10,.11,20
SOLCC10,.11,20
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
2.7 V
3 V
Surface Mount
YES
YES
Switch-off Time-Max
30 ns
50 ns
Switch-on Time-Max
50 ns
60 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
MATTE TIN
Tin/Lead (Sn90Pb10)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
3 mm
3 mm
Base Number Matches
2
2
Pbfree Code
Manufacturer Package Code
485C
Factory Lead Time
4 Weeks
Peak Reflow Temperature (Cel)
235
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AS4684NBG8 with alternatives
Compare NLAS4684MNR2 with alternatives