NLAS4684MNR2
vs
AS4684NBG
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFN
DFN
Package Description
3 X 3 MM, 0.5 MM PITCH, QFN-10
3 X 3 MM, ROHS COMPLIANT, DFN-10
Pin Count
10
10
Reach Compliance Code
unknown
compliant
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
S-XDSO-N10
S-XDSO-N10
JESD-609 Code
e0
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
NOT SPECIFIED
1
Number of Channels
1
1
Number of Functions
2
2
Number of Terminals
10
10
Off-state Isolation-Nom
65 dB
64 dB
On-state Resistance Match-Nom
0.06 Ω
0.6 Ω
On-state Resistance-Max (Ron)
1 Ω
0.8 Ω
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVSON
HVSON
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
240
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
2.7 V
Surface Mount
YES
YES
Switch-off Time-Max
50 ns
30 ns
Switch-on Time-Max
60 ns
50 ns
Technology
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
3 mm
Base Number Matches
2
1
Rohs Code
HTS Code
8542.39.00.01
Output
SEPARATE OUTPUT
Package Equivalence Code
SOLCC10,.11,20
Switching
BREAK-BEFORE-MAKE
Compare NLAS4684MNR2 with alternatives
Compare AS4684NBG with alternatives