AS28C010F-15/Q vs WE128K8150CIA feature comparison

AS28C010F-15/Q Micross Components

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WE128K8150CIA Microsemi Corporation

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Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROSS COMPONENTS MICROSEMI CORP
Part Package Code DFP DIP
Package Description DFP, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns 150 ns
Additional Feature 100 YEAR DATA RETENTION
Data Retention Time-Min 100
JESD-30 Code R-CDFP-F32 R-CDIP-T32
Length 20.828 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 3.1242 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.5 mm
Terminal Position DUAL DUAL
Width 11.049 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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