AS27C256A-25JM
vs
M38510/22401BYX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
MOTOROLA INC
Part Package Code
DIP
DIP
Package Description
,
DIP,
Pin Count
28
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Base Number Matches
1
4
Access Time-Max
250 ns
JESD-30 Code
R-XDIP-T28
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
MOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Compare AS27C256A-25JM with alternatives
Compare M38510/22401BYX with alternatives