AS27C256A-25JM
vs
5662-860632YA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROSS COMPONENTS
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
DIP
Package Description
,
HERMETIC SEALED, CERAMIC, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Base Number Matches
1
1
Access Time-Max
250 ns
JESD-30 Code
R-GDIP-T28
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Compare AS27C256A-25JM with alternatives
Compare 5662-860632YA with alternatives