AS27C256A-25JM
vs
DM27C256-25/B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
SEEQ TECHNOLOGY INC
Part Package Code
DIP
Package Description
,
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Base Number Matches
1
1
Rohs Code
Access Time-Max
250 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
JESD-609 Code
e0
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.00015 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Compare AS27C256A-25JM with alternatives
Compare DM27C256-25/B with alternatives