AM29LV800BB70SF vs AM29LV800BB70SC feature comparison

AM29LV800BB70SF Spansion

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AM29LV800BB70SC Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 44 44
Reach Compliance Code compliant compliant
Access Time-Max 70 ns 70 ns
Additional Feature CONFIGURABLE AS 512K X 16 CONFG AS 512K X 16; BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e3 e0
Length 28.2 mm 28.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Width 13.3 mm 13.3 mm
Base Number Matches 1 2

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