AM29LV800BB70SF vs AM29LV800BT70SIB feature comparison

AM29LV800BB70SF Spansion

Buy Now Datasheet

AM29LV800BT70SIB AMD

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code SOIC SOIC
Package Description SOP, MO-180AA, SOP-44
Pin Count 44 44
Reach Compliance Code compliant unknown
Access Time-Max 70 ns 70 ns
Additional Feature CONFIGURABLE AS 512K X 16 CONFG AS 512K X 16; TOP BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e3
Length 28.2 mm 28.2 mm
Memory Density 16777216 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 13.3 mm 13.3 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

Compare AM29LV800BB70SF with alternatives

Compare AM29LV800BT70SIB with alternatives