AM29LV800BB70SC
vs
AM29LV800BB70SD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
SPANSION INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
MO-180AA, SOP-44
Pin Count
44
44
Reach Compliance Code
compliant
compliant
Access Time-Max
70 ns
70 ns
Additional Feature
CONFG AS 512K X 16; BOTTOM BOOT BLOCK
CONFIGURABLE AS 512K X 16
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
JESD-609 Code
e0
e3
Length
28.2 mm
28.2 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
1048576 words
1048576 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
2.8 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
13.3 mm
13.3 mm
Base Number Matches
2
1
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