AM27S12FCB
vs
M38510/20404BFX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
LANSDALE SEMICONDUCTOR INC
Part Package Code
DFP
DFP
Package Description
DFP, FL16,.3
DFP,
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
70 ns
JESD-30 Code
R-CDFP-F16
R-XDFP-F16
JESD-609 Code
e0
Length
10.16 mm
Memory Density
524288 bit
262144 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
512 words
512 words
Number of Words Code
64000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
64KX8
32KX8
Output Characteristics
OPEN-COLLECTOR
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.159 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Width
6.731 mm
Base Number Matches
1
1
Screening Level
MIL-M-38510 Class B
Compare AM27S12FCB with alternatives
Compare M38510/20404BFX with alternatives