Memory
AM27S12FCB
AMD
Description: OTP ROM, 512X4, 50ns, Bipolar, CDFP16, CERAMIC, FP-16

Overview of AM27S12FCB by AMD

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation Computing and Data Storage Renewable Energy Robotics and Drones

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Part Data Attributes for AM27S12FCB by AMD

AM27S12FCB
AMD
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
Part Package Code
DFP
Package Description
DFP, FL16,.3
Pin Count
16
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
150 ns
JESD-30 Code
R-CDFP-F16
JESD-609 Code
e0
Length
10.16 mm
Memory Density
524288 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
16
Number of Words
512 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
75 °C
Operating Temperature-Min
Organization
64KX8
Output Characteristics
OPEN-COLLECTOR
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
Package Style
FLATPACK
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
2.159 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Width
6.731 mm
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  1. AM27S12FCB
    AMD
    OTP ROM, 512X4, 50ns, Bipolar, CDFP16, CERAMIC, FP-16
    VS

Alternate Parts for AM27S12FCB

This table gives cross-reference parts and alternative options found for AM27S12FCB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27S12FCB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AM27S13FC OTP ROM, 512X4, 50ns, Bipolar, CDFP16, CERAMIC, FP-16 AMD AM27S12FCB vs AM27S13FC
AM27S12FC OTP ROM, 512X4, 50ns, Bipolar, CDFP16, CERAMIC, FP-16 AMD AM27S12FCB vs AM27S12FC
Part Number Description Manufacturer Compare
53S241W883B OTP ROM, 512X4, 55ns, CMOS, CDFP20, Monolithic Memories (RETIRED) AM27S12FCB vs 53S241W883B
63S241WXXXX OTP ROM, 512X4, 45ns, CMOS, CDFP20, Monolithic Memories (RETIRED) AM27S12FCB vs 63S241WXXXX
53S241AW OTP ROM, 512X4, 45ns, CMOS, CDFP20, Monolithic Memories (RETIRED) AM27S12FCB vs 53S241AW
HM9-7621A5 OTP ROM, 512X4, 50ns, TTL, CDFP16 Harris Semiconductor AM27S12FCB vs HM9-7621A5
M38510/20404BFX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.375 INCH, FP-16 QP Semiconductor AM27S12FCB vs M38510/20404BFX
82S131A/BFA IC 512 X 4 OTPROM, 35 ns, CDFP16, CERAMIC, FP-16, Programmable ROM NXP Semiconductors AM27S12FCB vs 82S131A/BFA
M38510/20402BFA OTP ROM, 512X4, 85ns, Bipolar, 0.25 X 0.375 INCH, FP-16 Teledyne e2v AM27S12FCB vs M38510/20402BFA
53S241AW883B OTP ROM, 512X4, 45ns, CMOS, CDFP20, Monolithic Memories (RETIRED) AM27S12FCB vs 53S241AW883B
M38510/20404BFX OTP ROM, 512X4, 35ns, Bipolar, 0.25 X 0.375 INCH, FP-16 Lansdale Semiconductor Inc AM27S12FCB vs M38510/20404BFX
AM27S13A/BFA OTP ROM, 512X4, 40ns, Bipolar, CDFP16, CERAMIC, FP-16 Rochester Electronics LLC AM27S12FCB vs AM27S13A/BFA

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