AM27LS01/BEX
vs
AM27LS01ADC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
35 ns
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Length
19.431 mm
19.431 mm
Memory Density
256 bit
256 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
256X1
256X1
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
OPEN-COLLECTOR
Output Enable
NO
Package Equivalence Code
DIP16,.3
Screening Level
MIL-STD-883 Class C
Terminal Finish
TIN LEAD
Compare AM27LS01/BEX with alternatives
Compare AM27LS01ADC with alternatives